Hi Ioan,
With exposed die and wire bonds, I would say no for production. Maybe they
need it for a prototype...
Risk are, flux contamination, solder balls, handling damage. The reflow
temperature itself is not a problem, just everything that goes with it.
Glenn
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, June 30, 2005 7:49 AM
To: [log in to unmask]
Subject: [TN] Is wire bonding reflowable?
Hi Technetters,
a customer of ours is wondering if a module they are ordering will be OK to
solder in regular (SnPb for now) reflow. The module has an exposed die, no
encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
regular ICs can be reflowed with no issue, this module should not present
any hickup.
My exposure to wire bonding is zero, so I take this issue with you. Can this
question be answered as is, or would you need more details?
Thanks,
Ioan
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