Hi Technetters,

a customer of ours is wondering if a module they are ordering will be OK to solder in regular (SnPb for now) reflow. The module has an exposed die, no encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since regular ICs can be reflowed with no issue, this module should not present any hickup.

My exposure to wire bonding is zero, so I take this issue with you. Can this question be answered as is, or would you need more details?

Thanks,
Ioan

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