PRESENT A PAPER at IPCWorks 2005 technical conference, October 27, 2005
at the Sands Convention Center in Las Vegas, Nev.  Increase your
visibility in the industry at one of the nation's most appealing
conference destinations. 

This year's theme, "What's in Your Future?" focuses on conference topics
such as:

*        lead free - implementation, whisker failures--formation,
mitigation, reliability-temperature, cycling data, solderability, finish
alternatives to HASL, immersion tin and silver, solder leveling, etc.

*        materials declaration information and how it can improve
recycling-RoHS compliance, materials declaration practices, status of
standards activities

*        embedded passives-passives, actives, design, embedded or
integrated components fabrication, flexible circuits and materials

*       materials-new PCB materials, technology development, materials
for design; new dielectric materials (ceramics, biomedical materials,
nano materials, etc.)

We need your abstract by June 15, 2005.  It should summarize problems
and resolutions, methods used, results of experiments and benefits to
the industry.  Please detail case histories, field data, new
technologies/innovations or research and findings. 

If IPC selects your abstract, we will require your technical paper and
visuals by September 15.

For more information on the IPCWorks 2005 technical conference, contact
Mary Tunk, IPC's technical project manager at 847-597-2825 or Mary
[log in to unmask]

 


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