TECHNET Archives

June 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Habib Sahli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Habib Sahli <[log in to unmask]>
Date:
Wed, 29 Jun 2005 09:29:05 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
Hello All,  
  
This is the first time I join this Forum and I hope that someone has a good experience with Thick copper PCBs fabrication.  
  
In fact, I have to produce 6 oz copper thickness double side PTH PCBs and need to know what is the best flow chart and parameters for the curtain coating solder mask application to ovoid the major defects such us skipping, not covered track's edges and bubbles.  
  
Thanks

Habib


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2