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June 2005

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Crawford <[log in to unmask]>
Date:
Tue, 28 Jun 2005 17:01:06 -0500
Content-Type:
text/plain
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text/plain (108 lines)
Additional considerations are in 610D Clause 10.4.4 Flux Residues -
No-Clean Process - Appearance

Acceptable - Class 1,2,3
* Flux residue on, around, or bridging between noncommon lands,
component leads and conductors.
* Flux residue does not inhibit visual inspection.
* Flux residue does not inhibit access to test points of the assembly.

Acceptable - Class 1
Process Indicator - Class 2
Defect - Class 3
* Finger prints in no-clean residue.

Defect - Class 2,3
* Flux residue inhibits visual inspection.
* Flux residue inhibits access to test points.
     Note 1. There is no defect for discoloration of OSP coated
assemblies that come in contact with flux residues from no-clean
process.
     Note 2. Residue appearance may vary depending upon flux
characteristics and solder processes.

Defect - Class 1,2,3
* Wet, tacky, or excessive flux residues that may spread onto other
surfaces.
* No-clean flux residue on any electrical mating surface that inhibits
electrical connection.


Jack Crawford, IOM
IPC Director Certification and Assembly Technology 
[log in to unmask] 
847-597-2893 
FAX  847-615-5693 
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerry Savard
Sent: Monday, June 27, 2005 8:30 PM
To: [log in to unmask]
Subject: Re: [TN] No-clean residue requirements

IPC-A-610D, section 10.4.1, states as acceptable, Class 1,2,3 "No
discernible residue from cleanable fluxes is allowed" and "Flux residues
from no-clean processes may be allowed."  The 'may be allowed' part I
believe covers the bases for those products that have to be super clean
depending on its end-usage.  In general, no-clean will leave some
residue which is acceptable since it's activity is very low.

Gerry Savard



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jordan, Dave
Sent: Monday, June 27, 2005 8:46 PM
To: [log in to unmask]
Subject: [TN] No-clean residue requirements

I've got a customer claiming that the slight residue left on a board by
no-clean flux is a fault under either IPC-A-610 or J-STD-001. Perhaps
I'm missing it, but there doesn't seem to be any clear statement about
no-clean residue vs water wash in the standards. Any help out there?
Thanks in advance.

Dave
Production Operations
Nova Engineering

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