Sorry, Rudy, what you are saying is misleading. No flux for electronics 
soldering should contain HCl or HBr. They contain amine 
hydrochlorides/hydrobromides or amino acid hydrochlorides/hydrobromides, 
which is not at all the same thing. These decompose at soldering temp 
into hydrogen chloride or bromide gases, which are driven off. However, 
if they happen to meet water molecules, they will ionically react with 
them to form the acids. The residues, while still aggressive, will 
contain relatively small quantities of chlorides or bromides, if the 
soldering conditions are correct.

Also, many "no-clean" fluxes contain dibasic carboxylic acids as 
activators and considerable quantities of these will also be driven off 
in a vapour phase, by sublimation. There is therefore some resemblence 
in the way that active compounds are reduced in quantity with BOTH types 
of flux. This is in contrast with some types of rosin flux, whose 
residues are not significantly converted to a gas or vapour phase during 
soldering.

Brian

R Sedlak wrote:
> Some water soluble fluxes (the more aggressive)  contain Hydrochloric or Hydrobromic acids, which become volatile at soldering temperatures.
> 
> Rudy Sedlak
> RD Chemical Company
> 
> Shean Dalton <[log in to unmask]> wrote:
> Hi Rudy,
> 
> I was puzzled by your comment that, "unlike the water soluble flux
> acids, they do not vaporize during soldering" I suspect I am not
> understanding what you are saying; that said, my interpretation from the
> quoted sentence fragment is that water soluble flux acids vaporize
> during soldering. This has not been my experience; and I'd like to
> understand better what you are saying. Please help me understand.
> 
> Thanks,
> 
> Shean Dalton
> Austin American Technology
> www.aat-corp.com
> 512-335-6400
> 
> -----Original Message-----
> From: R Sedlak
> Sent: 6/27/2005 12:02 PM
> To: [log in to unmask]
> Subject: Re: [TN] Flux residues--Why
> 
> 
> David: No-clean residue is SUPPOSED to be hard to remove, this means it
> is unreactive, and thus will not corrode the part....
> 
> When you mix it with water soluble flux (which usually contain small
> amounts of strong acid), you reactivate the organic acids in the
> residues, and they can be quite corrosive, and unlike the water soluble
> flux acids, they do not vaporize during soldering, and this organic acid
> combined with the acid in the water soluble flux can work together to
> corrode.
> 
> Hope this helps.
> 
> Rudy Sedlak
> RD Chemical Company
> 
> David Tremmel wrote:
> Technetters,
> 
> I have received some microBGAs which I have to reball and they have a
> no-clean flux residue which is difficult to remove. Also, when it comes
> in
> contact with our water-soluble flux it creates an acid which is not very
> 'friendly' to the part.
> 
> Would any of the chemical gurus care to edify one of the uneducated ones
> why
> no-clean flux, when dried and allowed to set for a couple of months is
> so
> difficult to completely remove and what possible acids or chemicals are
> created when it is combined with water-soluble flux (type ORM1)?
> 
> As always, I appreciate the responses I receive.
> 
> David Tremmel
> Technical Manager
> BT Mexico
> 
> _________________________________________________________________
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