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Date: | Mon, 27 Jun 2005 10:15:35 +0700 |
Content-Type: | text/plain |
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Azman,
At present, we are using stencil with 6 mils of thickness, 13% reduction in
width and 20% reduction in Length
Nitrogen setting at reflow: 3000 ~ 9000 ppm, solder paste viscosity from 200
~ 240 (Pa.S).
With this setting, there is no problem about solder short at fine pitch
component.
Try to use.
Best regards.
Tung
----- Original Message -----
From: "Norazman Othman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, June 25, 2005 4:36 PM
Subject: Re: [TN] Lead free solder paste
> Thank Le Thanh Tung,
>
> Ok here are some parameters as you requested..
> Smallest fine pitch: 20mils
> Stencil design: Laser cut, 5mils of thickness, 10% reduction for fine
pitch
> IC
> Printer: DEK288
> Solder paste: Kester EM907
>
>
> Best Regards,
> Azman
>
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