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June 2005

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Sun, 26 Jun 2005 21:03:50 -0500
Content-Type:
text/plain
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text/plain (50 lines)
Could be your set-up. We got rather acceptable results with that paste
and without using reduction of apertures. 


Rich K KEDS

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Norazman Othman
Sent: Saturday, June 25, 2005 4:36 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free solder paste

Thank Le Thanh Tung,

Ok here are some parameters as you requested..
Smallest fine pitch: 20mils
Stencil design: Laser cut, 5mils of thickness, 10% reduction for fine
pitch IC
Printer: DEK288
Solder paste: Kester EM907


Best Regards,
Azman

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