Hi Alexandria,

Is the July 27 meeting in San Jose or San Diego?  The registration page
says San Diego. Could you please confirm. Thank-you




At 05:18 PM 6/22/2005 -0500, you wrote:
>BGA and CSP Design and Assembly Process Implementation Using Lead Free Solder
>July 25, 2005 - Portland, OR
>July 27, 2005 - San Jose, CA
>
>Instructor: Vern Solberg
>
>Price: $495 IPC/Designers Council member
>        $695 Non-member
>
>To produce a RoHS compliant BGA and CSP assembly, the industry must
>consider a number of new process variables. With the conversion to lead
>free soldering, both components and circuit boards will be exposed to
>higher temperatures at extended lengths of time. The Ball Grid Array and
>Chip-Scale Package families of components, of course, are often seen by
>many as the best solution to meet the space restrictions of newer
>generations of electronic products. However, most of these devices are
>packaged using organic materials that don't stand up to these higher
>process temperatures. And, most of the organic substrate materials
>traditionally used for fabricating the circuit board are not compatible
>with the new levels of assembly. To address these issues, improvements e
>in materials and processes for package assembly have been made. In
>addition, the laminate manufacturers have a number of ways to manufacture
>printed circuit boards that will remain physically stable when exposed to
>the temperatures required for lead free assembly.
>
>This half-day workshop will cover both wide and fine pitch BGA packaging
>methodology, packaging standards, qualification requirements land pattern
>geometry alternatives and circuit routing guidelines. Important factors
>related to specifying base materials and surface finishes compatible with
>lead free soldering will also be discussed.
>
>To register for one of these workshops, please go to
>http://www.ipc.org/calendar/2005/lfBGAimplement_0705/BGAcspLF_0705.htm. or
>contact IPC's registration department at [log in to unmask] or call
>847-597-2861.
>
>*****SPECIAL GROUP RATE: For a limited time only Register 3 people from
>the same company at the same time for the same workshop date and receive
>the fourth registration FREE! This offer ends June 30th.
>
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>847-615-7100 ext.2815
>-----------------------------------------------------

Thank-you

Mumtaz

  D/ 8165 - SMT Process Quality
  Bldg. V244H
Voice  (858)-882-1967
Fax    (858)-882-3511
Page  (858)-635-1180
email: [log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------