Hi all,

Recently I had a problem with printing the lead free solder paste, almost
every board has bridging especially on the fine pitch locations. Anyway
this problem never happens when we use leaded solder paste. So I would like
to ask if there are any special controls such as environment, viscosity,
stencil design and printer parameters in order to achieve good printing for
lead free solder paste.


Best regards
Azman
Process Eng.

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