Hi All

Thank you for the great input.  I have incorporated these possible root
causes as a set of actions for our team to go off and investigate.  We are
also considering moving towards ENIG or Imm Ag as a other alternative.



Thanks again for your help!

Karen Walters Ebner
Raytheon Electronic Combat Systems
Towson, MD 21286
410.583.4082



R Sedlak <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/17/2005 05:05 AM
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Re: [TN] HASL Leveling






To add one more to Mr. Asbell's impressive list...

Dirty, or tarnished Copper pads prior to HAL

Rudy Sedlak
RD Chemical Company

Franklin D Asbell <[log in to unmask]> wrote:
1. Inadequate air flow
a. Low air pressure
b. block or disrupted air knives
c. dwell time (under air pressure)
d. incorrect air setting (on or off too early/late)

2. Orientation of the panel in the HASL process.
3. Temperature of the solder
4. Contaminates in the solder

Of these, cause #1 is the most likely in my experience.

Franklin

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