I have only seen wire bonding attachments inside pockets.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Richard [mailto:[log in to unmask]] 
Sent: Thursday, June 23, 2005 3:25 AM
To: [log in to unmask]
Subject: [TN] solder paste deposit on internal layer?

Dear TN Members,

First off, I need to thank everyone for their answers to my question
regarding the construction of an unusually thick PCB.  I really meant to
send that out about a month ago but was bad and let myself get buried in
the
next thing...

I am back on that project now, and have received the prototypes which
were
built just fine.  In review, this PCB has an external un-etched "cover"
layer made from a sheet of polyimide that is adhered to the top surface
of
the actual circuit carrying PCB.

Now the problem is how to apply solder paste to the pads on the IC lands
that are accessible through cut-outs, below the surface of the cover
layer.

Does anyone know if it is possible for solderpaste to be applied before
a
top layer is fixed?  The cover layer is being bonded with a super high
performance 3M adhesive.  I don't think it will ever actually be
laminated
in the stack-up, but I could be wrong.

Thank you very very much if you have ever heard of such a thing, or have
any
advice.

I am just a contractor, and the client would require the sigining of an
NDA,
so I am not completely free to pass their information on to the forum.
If
you represent a company I could of course forward your proposals to
management.

Richard

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