Dear TN Members,

First off, I need to thank everyone for their answers to my question
regarding the construction of an unusually thick PCB.  I really meant to
send that out about a month ago but was bad and let myself get buried in the
next thing...

I am back on that project now, and have received the prototypes which were
built just fine.  In review, this PCB has an external un-etched "cover"
layer made from a sheet of polyimide that is adhered to the top surface of
the actual circuit carrying PCB.

Now the problem is how to apply solder paste to the pads on the IC lands
that are accessible through cut-outs, below the surface of the cover layer.

Does anyone know if it is possible for solderpaste to be applied before a
top layer is fixed?  The cover layer is being bonded with a super high
performance 3M adhesive.  I don't think it will ever actually be laminated
in the stack-up, but I could be wrong.

Thank you very very much if you have ever heard of such a thing, or have any
advice.

I am just a contractor, and the client would require the sigining of an NDA,
so I am not completely free to pass their information on to the forum.  If
you represent a company I could of course forward your proposals to
management.

Richard

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