BGA and CSP Design and Assembly Process Implementation Using Lead Free Solder
July 25, 2005 - Portland, OR
July 27, 2005 - San Jose, CA

Instructor: Vern Solberg

Price: $495 IPC/Designers Council member
       $695 Non-member

To produce a RoHS compliant BGA and CSP assembly, the industry must consider a number of new process variables. With the conversion to lead free soldering, both components and circuit boards will be exposed to higher temperatures at extended lengths of time. The Ball Grid Array and Chip-Scale Package families of components, of course, are often seen by many as the best solution to meet the space restrictions of newer generations of electronic products. However, most of these devices are packaged using organic materials that don't stand up to these higher process temperatures. And, most of the organic substrate materials traditionally used for fabricating the circuit board are not compatible with the new levels of assembly. To address these issues, improvements e in materials and processes for package assembly have been made. In addition, the laminate manufacturers have a number of ways to manufacture printed circuit boards that will remain physically stable when exposed to the temperatures required for lead free assembly.
 
This half-day workshop will cover both wide and fine pitch BGA packaging methodology, packaging standards, qualification requirements land pattern geometry alternatives and circuit routing guidelines. Important factors related to specifying base materials and surface finishes compatible with lead free soldering will also be discussed.

To register for one of these workshops, please go to http://www.ipc.org/calendar/2005/lfBGAimplement_0705/BGAcspLF_0705.htm. or contact IPC's registration department at [log in to unmask] or call 847-597-2861.

*****SPECIAL GROUP RATE: For a limited time only Register 3 people from the same company at the same time for the same workshop date and receive the fourth registration FREE! This offer ends June 30th.

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