610-D Section 1.4 on Cleanliness says to refer to 1.8 for magnification. 1-8
then says, in table 1-3, for cleanliness of regular, Magnification not
needed. For no-clean process under Note 1: it says 'may' require
magnification (fine pitch, high density), or if contamination affects form
fit or function. Then of course table 1-2 has the various magnification
levels for inspection/referee.
So - the key word here is 'may'. We use standard visual with no
magnification, but if your customer requires otherwise, then you have to
work out something with them you can both agree on. I have found that if
your using no-clean properly, and you supply your customer with no-clean
data - the perceived problems go away.
You said 10x for solder joints - we usually use 3 to 3.5 for most solder
joints (only because the eye loops our people all have are those
magnification levels. Inspectors do have higher power loupes when needed).
Tom Parkinson
Quality System Manager - CIT
WinTronics, Inc.
Phone: 724-981-5770 - extension 235
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Daan Terstegge
Sent: Wednesday, June 22, 2005 12:07 PM
To: [log in to unmask]
Subject: [TN] Magnification for cleanliness inspection
Hi Technet,
It's been some time since my last post to this forum, unfortunately I
was to busy to follow the discussions or contribute to them! But now I
need some advice:
The ANSI/JSTD 001 clearly states that inspection for cleanliness
should be done without any magnification.In the IPC-A-610 this remark
about not using magnification is missing, therefore it is thought by
one of our customers that whenever you see a residue with the
magnification that's used for inspecting the solder joint (i.e. 10
times), it must be reworked if the residue is present on the
solderjoint.
To my knowledge it is not intended for the IPC-A-610 to be much more
critical than the J-STD-001, and I believe this is not the correct way
to inspect.
How do you think about this?
Best regards,
Daan Terstegge
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
