Hi Technet,

It's been some time since my last post to this forum, unfortunately I
was to busy to follow the discussions or contribute to them! But now I
need some advice:

The ANSI/JSTD 001 clearly states that inspection for cleanliness
should be done without any magnification.In the IPC-A-610 this remark
about not using magnification is missing, therefore it is thought by
one of our customers that whenever you see a residue with the
magnification that's used for inspecting the solder joint (i.e. 10
times), it must be reworked if the residue is present on the
solderjoint.
To my knowledge it is not intended for the IPC-A-610 to be much more
critical than the J-STD-001, and I believe this is not the correct way
to inspect.

How do you think about this?

Best regards,

Daan Terstegge

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