Europe is always a little in advance compared with the US, so I use to get
them even before they are put up in Oklahoma..
Inge
PS. Steve needs something to chuckle at...poor man, arbitrator for more than
1,000 quarrelsome techies..
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: den 22 juni 2005 15:55
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
For those of you who benefit from Steve's website:
I have noticed that there is a little delay before the rest of us can
see the pics, for some reason.
If you do not see new pics right away after he says they are there, just
wait a few minutes and try again.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Wednesday, June 22, 2005 8:37 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Hi George!
Yep, they're up...I just checked.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | "Wenger, George |
| | M." |
| | <George.Wenger@an|
| | drew.com> |
| | |
| | 06/22/2005 07:44 |
| | AM |
| | |
|---------+---------------------------->
>-----------------------------------------------------------------------
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|
|
| To: "TechNet E-Mail Forum" <[log in to unmask]>,
<[log in to unmask]> |
| cc:
|
| Subject: RE: [TN] BGA Intermittent Saga, part 2
|
>-----------------------------------------------------------------------
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Steve,
Are you sure they are up I can't see them on page 2?
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen Gregory
Sent: Wednesday, June 22, 2005 8:37 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Good Mornin' Leo and Everyone!
Well, today is starting off really good! (but I just got in...hehehe).
Your two pictures are up Leo. Go to: http://www.stevezeva.homestead.com
and click on Picture Page 2, and look for; "No Nickel Corrosion, and
Nickel Corrosion".
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Leo Higgins |
| | <Leo_Higgins@ASAT|
| | .COM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 06/21/2005 11:18 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to Leo |
| | Higgins |
| | |
|---------+---------------------------->
>
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|
|
| To: [log in to unmask]
|
| cc:
|
| Subject: Re: [TN] BGA Intermittent Saga, part 2
|
>
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I will send a pair of pictures from an Amkor paper showing optical
micrographs showing Ni corrosion and a pad with no Ni corrosion to Steve
to see if he can put up on his web site. Published studies on Black Pad
issues often show similar structures. Steve can you post the 2 photos?
I will send after this note.
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is
CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only
for the use of the individual or entity named above. If the reader of
this message is not the intended recipient, you are hereby notified that
any dissemination, distribution and copying of this communication is
strictly prohibited. If you have received this communication in error,
please immediately notify the sender by electronic mail. Thank you.
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, June 13, 2005 2:16 PM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] BGA Intermittent Saga, part 2
You state to look for Au cyanide etching in the eless Ni. With what
instrument or is this under a high power micro scope (1000X). Can you
describe what to look for or perhaps you can share a photo of the
artifact you are suggesting.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Monday, June 13, 2005 1:39 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Excessive stress from pneumatic presses used to bond heat sinks to BGAs
after board level assembly has been shown to induce failure at the
solder to BGA pad on packages that meet pre-SMT assembly quality specs
in all ways.
Subsequent analyses may show no evidence of black pad (cross sectioning
to look for Au cyanide etching into the eless Ni, etc.).
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is
CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only
for the use of the individual or entity named above. If the reader of
this message is not the intended recipient, you are hereby notified that
any dissemination, distribution and copying of this communication is
strictly prohibited.
If
you have received this communication in error, please immediately notify
the sender by electronic mail. Thank you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway
Sent: Monday, June 13, 2005 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Werner,
If it's black pad on the component side, how would Kerry prove or
disprove it? Could he find the cause by using Auger or cross-section?
What would be the appropriate tests to perform to find root cause?
Should he send a component back to the supplier for root cause analysis?
Thank you,
Jana Carraway
Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR 97035
503.697.5291, ext 1180
email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Monday, June 13, 2005 10:04 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Hi Kerry,
You most likely have 'Black Pad' on the componet side. That, together
with the stess concentration from the SMD-geometry, caused a briitle
ionterfacial overstress failure.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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