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June 2005

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Wed, 22 Jun 2005 10:26:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (274 lines)
Right, it does sound weird and on top of it, the Ni layer doesn't look that bad (cavitation wise I mean). What I think might have happen is that the platter had a problem with ENIG (gold layer to be exact) and decided to strip off Au and plate with Sn. As far as I know, they do it.

Vladimir

Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2

Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Wednesday, June 22, 2005 10:02 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2


Nickel corrosion? Under tin plating? I don't understand. 

I would rather suggest tin plating over bad wetting. In all metalurgical
handbooks, nickel has the grade 'poor' , when talking solder wetting.
I've had several incidents with bad tin plating on nickel the last year.
E.g. a multipin plastic package, on which we could shear off the tin by
pulling the component legs between your thumb and index finger nails!! 

If it's really nickel corrosion, what caused that? This is not a ENIG
nickel corrosion situation. Is it possible to get a SEM cross section
image?

Good Luck

Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Leo Higgins
Sent: den 22 juni 2005 06:18
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2


I will send a pair of pictures from an Amkor paper showing optical
micrographs showing Ni corrosion and a pad with no Ni corrosion to Steve to
see if he can put up on his web site.  Published studies on Black Pad issues
often show similar structures.  Steve can you post the 2 photos?  I will
send after this note.


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, June 13, 2005 2:16 PM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] BGA Intermittent Saga, part 2


You state to look for Au cyanide etching in the eless Ni.   With what
instrument or is this under a high power micro scope (1000X).   Can you
describe what to look for or perhaps you can share a photo of the
artifact you are suggesting.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Monday, June 13, 2005 1:39 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2

Excessive stress from pneumatic presses used to bond heat sinks to BGAs
after board level assembly has been shown to induce failure at the
solder to
BGA pad on packages that meet pre-SMT assembly quality specs in all
ways.
Subsequent analyses may show no evidence of black pad (cross sectioning
to
look for Au cyanide etching into the eless Ni, etc.).


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


The information contained in this electronic message is
CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not
the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited.
If
you have received this communication in error, please immediately notify
the
sender by electronic mail. Thank you.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway
Sent: Monday, June 13, 2005 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2


Werner,

If it's black pad on the component side, how would Kerry prove or
disprove
it?  Could he find the cause by using Auger or cross-section?  What
would be
the appropriate tests to perform to find root cause?  Should he send a
component back to the supplier for root cause analysis?

Thank you,
Jana Carraway

Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR  97035
503.697.5291, ext 1180
email: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Monday, June 13, 2005 10:04 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2


Hi Kerry,
You most likely have 'Black Pad' on the componet side. That, together
with
the stess concentration from the SMD-geometry, caused a briitle
ionterfacial
overstress failure.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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