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June 2005

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Subject:
From:
Kerry McMullen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 21 Jun 2005 14:58:29 -0400
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Hi Steve,

Its interesting that all the test point probe marks are all dead center. I
would still send back.  You are loosing too much circular area which would
cause too much paste to flow towards the trace leading towards the via.
Your resulting solder joint would be misaligned causing potential
fractures.





Stephen Gregory <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/21/2005 02:44 PM
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Subject
[TN] Mis-registered soldermask on BGA pads...






Hi folks!

Just got some bare fabs at the back door, and found that the
soldermask is mis-registered around the BGA pads.

The design is that the pads are supposed to be NSMD pads,
but only half the pad is...

I think I'm going to return these boards to sender, just checking
with you all to see if you would do the same thing...

You can see what they look like at:

http://www.stevezeva.homestead.com click on Picture Page 2,
then look for Mis-registered Mask...

Once, just once, I wish I could come into work and not have some
sort of problem...but I guess that's why I have a job. Oh well...


Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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