Our fab note  requires  the copper thickness in hole wall to be no less than 1.0mil. Meantime the plating thickness on the surface shall be no more than 25% that of the hole wall. Our suppliers think this is too tight a tolerance and would like minimum copper thickness to be 1.4 mil.  They say it will result in higher scrap rate and yield loss. Any feedbak on possible issues with increasing the thickness from electrical design point of view?

Regards,


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