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June 2005

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Subject:
Re: HASL Leveling
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Fri, 17 Jun 2005 02:05:15 -0700
Content-Type:
text/plain
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text/plain (47 lines) 
To add one more to Mr. Asbell's impressive list...

Dirty, or tarnished Copper pads prior to HAL

Rudy Sedlak
RD Chemical Company

Franklin D Asbell <[log in to unmask]> wrote:
1. Inadequate air flow
a. Low air pressure
b. block or disrupted air knives
c. dwell time (under air pressure)
d. incorrect air setting (on or off too early/late)

2. Orientation of the panel in the HASL process.
3. Temperature of the solder
4. Contaminates in the solder

Of these, cause #1 is the most likely in my experience.

Franklin

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