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Date: | Wed, 1 Jun 2005 16:50:12 -0700 |
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ipc 4101a, paragraph 3.9.1.1, page 13, iaw table 3-1, and test procedure in ipc tm 650.
phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of bob wettermann
Sent: Wednesday, June 01, 2005 2:04 PM
To: [log in to unmask]
Subject: [TN] Specification of Adhesive Strength of Trace to Original
Rigid Circuit Board
Dear Technetters:
Does anyone know if and where there is specification of the pull/adhesive strength of a copper trace to a rigid circuit board (ie bare board)?
Regards
Bob Wettermann
Bob Wettermann
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PH 847-767-5745
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