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June 2005

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Subject:
From:
Nimal Liyanage <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nimal Liyanage <[log in to unmask]>
Date:
Thu, 16 Jun 2005 09:13:26 -0700
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Ahmet:
I sent you a couple of messages to your personal e-mail address.Let me know if you need further help.

Nimal Liyanage
Metallic Resources Inc
Newport Beach,CA

Ahmet Ferit Cožan <[log in to unmask]> wrote:
Hi,
is there anyone that could inform me about the new lead-free HAL process
specifications.
What is the new dwell time, temperature?
If we want to use CEM1 material, is there any disease probability bsecause
of the thermal shock, etc.
I'll be appreciated if anyone can advice me information sources about the
new HAL procedures (Solder thickness, temperature range, dwell time, solder
bath material, etc.)

Thanks for all responses

Best regards

Ferit

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Nimal Liyanage,Ph.D.
Director of Business Development
Metallic Resources Inc.
27 Shearwater Place, Newport Beach, CA 92660
949 854 7898
949 854 7175 fax
949 697 5826 mobile







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