Steve,
I am a bit confused. If you are going to use a leaded paste at say
215-220C, then you are not going to melt lead free BGA balls, so why the
concern about voiding? There is more of an issue with leaded balls in a
lead free process. Or did I miss an e-mail or two... or am I missing a
few crucial brain cells this morning? :)
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: June 16, 2005 9:55 AM
To: [log in to unmask]
Subject: Re: [TN] WAS NTC, now BGA reballing...
Mornin' Ioan!
You know, that hasn't occured to me. Maybe somebody else that
knows more about metallurgy than I do could answer. I wouldn't think
that would be a huge issue though...I might be wrong.
The point in reballing with 63/37 spheres is to avoid all the voiding
issues with lead free spheres, and to replace them with a alloy that's
better understood as far as performance and reliability is concerned.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | "Tempea, Ioan" |
| | <itempea@POSITRON|
| | .QC.CA> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 06/16/2005 07:45 |
| | AM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to |
| | "Tempea, Ioan" |
| | |
|---------+---------------------------->
>-----------------------------------------------------------------------
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| To: [log in to unmask]
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| cc:
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| Subject: Re: [TN] NTC-Really, really pretty solder...
|
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Hi Stevie Roy,
you might want to keep it NTC, but I see a very technical issue here.
This
is the re-balling with 63/37. The original balls were lead-free,
therefore
having created some specific intermetallics between the chip and the
ball.
If you put the leaded balls on, how reliable will be the new
intermetallics
that are formed?
Just a thought.
Regards,
Ioan
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Stephen Roy Gregory
> Sent: Wednesday, June 15, 2005 11:02 PM
> To: [log in to unmask]
> Subject: [TN] NTC-Really, really pretty solder...
>
> Hi everyone!
>
> First, I want to express why I posted what I did earlier. I see all
this
> "Lead-free" stuff in
> every trade magazine that I pick-up, I get spam email from everywhere
that
> you can imagine, about lead-free seminars, training classes, why I
need
to buy
> different equipment, yada-yada-yada.
>
> But then I hear off-the-record from engineers at companies who are our
> customers, that they aren't even thinking about lead-free solders.
>
> I'm starting to look at tinning all components with standard 63/37
solder,
> re-balling BGA's with 63/37 spheres, and every other means available
to
meet our
> customer demand to stay away from anything and everything lead-free,
and
to
> try and remain competitive. On top of all of this, I will probably
have
to
> figure out how to run a lead-free line and keep everything under
control
at the
> same time, because we do have customers that will be marketing their
stuff in
> Europe... talk about alligators!
>
> We don't have a big engineering staff, or a nice lab to do experiments
or
> analysis. We're not unlike a lot of EMS companies our size. We're a
high
mix, low
> volume shop that specialize in defense and military electronics,
that's
our
> heritage. We do things in the way that has been proven, and known to
be
> reliable. When this lead-free deal was put on the table, it has turned
things upside
> down for me at least. I guess I was just trying to find out if anyone
else
> felt as p*ssed off as I am and as overwhelmed about lead-free as I do.
>
> On a lighter note, but in the same vein though, I took a cue from an
earlier
> post, and have created an image on my web page of what Tin/lead solder
might
> appear as in the year 2010.
>
> Take a look at: http://www.stevezeva.homestead.com , go to Picture
Page
2,
> and look at; "REAL Pretty Solder".
>
> -Steve Gregory-
>
>
>
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