Solder temperature and dwell time is heavily influenced by the panel design,
Leveling machine type and solder alloy used; but it will be in the range of
265-280C and 2 - 8 seconds. The thickness range will be tighter and
typically 1.5 to 12 microns.  We regularly process CEM1 for customers. 

If you would like us to process samples for you to determine a capability
with you panels please contact me directly..

-----Original Message-----
From: Ahmet Ferit Coþan [mailto:[log in to unmask]] 
Sent: 15 June 2005 03:24 PM
To: [log in to unmask]
Subject: [TN] Lead Free HASL Process


Hi,
is there anyone that could inform me about the new lead-free HAL process
specifications. What is the new dwell time, temperature? If we want to use
CEM1 material, is there any disease probability bsecause of the thermal
shock, etc. I'll be appreciated if anyone can advice me information sources
about the new HAL procedures (Solder thickness, temperature range, dwell
time, solder bath material, etc.)

Thanks for all responses

Best regards

Ferit

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