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June 2005

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Subject:
From:
"Morse, Carrie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Morse, Carrie
Date:
Wed, 15 Jun 2005 10:00:26 -0400
Content-Type:
text/plain
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text/plain (73 lines)
I'd bake them only if they need to be baked based on their MSL rating.
If they are a 3 -- then yes -- bake them and re-pack them properly.
But...be careful...if you keep opening and exposing the comps, you may
need to rebake which may cause solderability issues. 

In addition, if the tape they are in cannot handle the bake temp, you
may need to lower the bake temp and increase the time, or, remove and
bake then repack (in tubes). Of course...this now introduces the
possibility of damaging leads.

-Carrie

  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Wednesday, June 15, 2005 9:42 AM
To: [log in to unmask]
Subject: [TN] Baking PLCC-68's...

Just wondering, how many of you have ever baked a PLCC-68?

We've been raising the awareness level of our stockroom people about
component moisture sensitivity, and we've got some PLCC-68's that are on
a reel and been sitting on on our stockroom shelf for longer than
168-hours.

Well, we got another reel of the same part number (it's an Intel i960
PLCC-68) that came to us from Avnet in a vacuum sealed bag with a
level-3 MSL label on it.

I've never baked a PLCC-68...should I bake the reeled parts that have
been sitting on the shelf?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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