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June 2005

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Subject:
Drop Test/Dynamic Test data for Sn/3.0Ag/0.5Cu(SAC 305)
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Tue, 14 Jun 2005 16:35:00 -0700
Content-Type:
text/plain
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text/plain (30 lines) 
Dear All,


I am looking for Dynamic Test Data for Lead free Alloy SAC 305 for
cellphone applications. I have seen some data that indicates overall
dynamic test performance in Pb Free solder (SAC 305) is lower than the
existing Pb solder.(63/37). Any references to industry data
for keypad test or phone drop test using 8-10 layer microvia boards will be
appreciated.
Thank-you

Mumtaz

  D/ 8165 - SMT Process Quality
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