Hi Technos,

I start being confused by the thread started by Ingemar, so I would like to widen the topic a bit.

1. The ceramic caps will be more prone to internal cracks when on lead-free. To prevent that it is necessary to eliminate the fillets and make the joints thicker. I've been through major fighting here to get the designers stick to IPC-7531, now I have to make them change the CCs... Well, that's my problem. On the other hand, besides overprinting, are there any other solutions to increase the height of the solder joint (I assume applications where stencils thicker than 6 mils are not an option)

2. Recently Ingemar made a statement on the tantalum caps, that they should be a stay-away. Why?

3. What about embedded passives in lead-free? Any data, Happy Holden?

Thanks,
Ioan


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