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June 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Tue, 14 Jun 2005 09:24:58 +0200
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text/plain (48 lines)
Kerry,

maybe little odd type of failure this one: TI had problems with ball-off'ing, as they called it. Reason was that the packages had been exposed to humidity.

another reason can simply be that the BGA supplier used too much gold, if it was such an UBM system. We had some gold embrittlement BGA ball-offs some years ago. Also very rare.

Your case must be very unique in these days of BGA perfection...

Ingemar

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: den 13 juni 2005 18:09
To: [log in to unmask]
Subject: [TN] BGA Intermittent Saga, part 2


Hi Technetters,
Looks like we might have solved our BGA intermittent.  Two boards were
accidently dropped from  a height of 12" (off a tray).  The (4) 1028 ball
BGAs popped off both boards!  What is really interesting is that all the
balls stayed on the boards, not on the device substrate.   Any idea what
would cause this?  I know that you normally need a hammer to get a BGA off
the board (unless you have an SRT).  The device sees about 205 C at peak.

Thanks in advance?
Kerry

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