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June 2005

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Subject:
From:
Jean Hebeisen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jean Hebeisen <[log in to unmask]>
Date:
Mon, 13 Jun 2005 16:21:39 -0500
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Time is running out to join us for IPC's International Conference on
Flexible Circuits, Chip Scale Packaging and Radio Frequency
Identification to be held in Minneapolis, Minnesota, at the Crowne
Plaza/Minneapolis Northstar on June 21-23.  This amazing three day event
will include an entire day of educational courses and two days of
conference sessions.  Go to http://www.ipc.org/Flexnchips
<http://www.ipc.org/calendar/2005/FlexCSP_RFID605/FlexCSPRFID_Conf0605.h
tm#Registration>  to download a registration form and fax it to
847-615-7105.  For more information or call Jean Hebeisen at
847-597-2838.

                          **GET THE LATEST ON FLEXIBLE CIRCUITRY**

Advances in this industry are dramatic in their scope and coverage in
the global market. Chip scale packaging (CSP) saves real estate through
increased circuit density. Within this conference, flexible circuitry
and CSP uses, including RFID, will be discussed standalone and in
combination.  Get on the fast track and learn what you need to get ahead
of the competition!

                        Find Out About RFID and its Applications and
Benefits!  

RFID is a generic term for chip scale technologies that use radio waves
to automatically identify objects. There are several methods of
identification, the most common being to store an identifying serial
number on a microchip that is attached to an antenna. Together, the chip
and antenna are designated as an RFID tag or transponder. By easily
tracking a product from manufacture to operation in the field, RFID can
better prevent supplier/customer misunderstandings and increase the
amount of product information that can be tracked.  

 

Take a look at some of the illuminating sessions being offered:   

*         Super Synergy = Flex + Chip + RFID

*         Practical Use of RFID in Electronics Manufacturing

*         Laser Ablation

*          Novel Flex-Based IC Packaging and Interconnection Structures
for High Performance Applications 

*         RoHS Compliant Final Finishes on Flex: Processes and
Characteristics

 

Hear company representatives from Tessera, ET-Trends LLC, Sanmina-SCI
and DuPont, to name a few as they share their flexible circuitry, CSP
and RFID knowledge.

 

And, check out the tabletop exhibits during the conference break where
you'll get details on the latest technology.

 

Get ready for RFID and stay on top of flex circuitry. Register now at
www.ipc.org/Flexnchips 

 

 

 

            

 

 


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