Excessive stress from pneumatic presses used to bond heat sinks to BGAs
after board level assembly has been shown to induce failure at the solder to
BGA pad on packages that meet pre-SMT assembly quality specs in all ways.
Subsequent analyses may show no evidence of black pad (cross sectioning to
look for Au cyanide etching into the eless Ni, etc.).
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway
Sent: Monday, June 13, 2005 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Werner,
If it's black pad on the component side, how would Kerry prove or disprove
it? Could he find the cause by using Auger or cross-section? What would be
the appropriate tests to perform to find root cause? Should he send a
component back to the supplier for root cause analysis?
Thank you,
Jana Carraway
Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR 97035
503.697.5291, ext 1180
email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Monday, June 13, 2005 10:04 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Hi Kerry,
You most likely have 'Black Pad' on the componet side. That, together with
the stess concentration from the SMD-geometry, caused a briitle ionterfacial
overstress failure.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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