YIKES!
You mean that we could be getting BGA's with Black Pad from
the manufacturers? Now that IS scarey!
Werner; how often have you seen that? Is this something that
should concern us a little, or a lot?
Kerry; if you could, would you mind sharing with us the part number
and manufacturer of the device? We just quoted some work here
that has some 1028-ball BGA's, and I wonder if I'm gonna be in the
same boat that you're in.
Kind Regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Werner Engelmaier|
| | <[log in to unmask]
| | OM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 06/13/2005 12:04 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to |
| | Engelmaier |
| | |
|---------+---------------------------->
>--------------------------------------------------------------------------------------------------------------|
| |
| To: [log in to unmask] |
| cc: |
| Subject: Re: [TN] BGA Intermittent Saga, part 2 |
>--------------------------------------------------------------------------------------------------------------|
Hi Kerry,
You most likely have 'Black Pad' on the componet side. That, together with
the stess concentration from the SMD-geometry, caused a brittle interfacial
overstress failure.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
*************************************************************************
Hi Technetters,
Looks like we might have solved our BGA intermittent. Two boards were
accidently dropped from a height of 12" (off a tray). The (4) 1028 ball
BGAs popped off both boards! What is really interesting is that all the
balls stayed on the boards, not on the device substrate. Any idea what
would cause this? I know that you normally need a hammer to get a BGA off
the board (unless you have an SRT). The device sees about 205 C at peak.
Thanks in advance?
Kerry
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