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June 2005

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 13 Jun 2005 12:13:26 -0400
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Kerry,

Ask your BGA vendor what the surface finish was on the BGA substrate?  It sound like it might have been ENIG.

Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Monday, June 13, 2005 12:09 PM
To: [log in to unmask]
Subject: [TN] BGA Intermittent Saga, part 2


Hi Technetters,
Looks like we might have solved our BGA intermittent.  Two boards were
accidently dropped from  a height of 12" (off a tray).  The (4) 1028 ball
BGAs popped off both boards!  What is really interesting is that all the
balls stayed on the boards, not on the device substrate.   Any idea what
would cause this?  I know that you normally need a hammer to get a BGA off
the board (unless you have an SRT).  The device sees about 205 C at peak.

Thanks in advance?
Kerry

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