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June 2005

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Subject:
From:
Susan Mansilla <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 13 Jun 2005 09:06:40 EDT
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Ken
You must take into consideration the aspect ratio of your boards that will
have immersion silver put on them.  While I understand from the two additonal
posts that you might be able to successfully get complete coverage, I have seen
too many boards with bare copper in the holes subsequently attacked by either
silver chemistry or assembly chemistries that have failed.

Pluggin one end of a hole creates a "cup" which is difficult to get solutions
into and out of when processing.

Perhaps the group has guidelines for aspect ratios where one side plugs prior
to final finish are NOT recommended as manufacturable.

Susan Mansilla
Robisan Laboratory

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