TECHNET Archives

June 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sat, 11 Jun 2005 10:16:36 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (49 lines)
Hi Siggi,
I have answered this question a number of times before.
No standards on shear/pull testing exist—nor should they exist. And there are 
good reasons none exists.
First, there cannot be such thing as a true shear/pull test;' while you are 
of course stressing the solder joint, what you are doing to the solder joint in 
most cases is primarily peeling it—the proper reference would be a 'peeling' 
test. 
Second, the solder joint strength, as determined by a lead peeling test, has 
no bearing on the reliability of the solder joint, provided the peeling test 
does not reveal inadequate wetting or poor metallization, e.g., 'Black Pad.’
Third, in a peeling test you always need to observe the whole peel-load 
history for the whole peeling process; e.g., with a leaded solder joint the largest 
load will be at the initial portion of peeling through the heel fillet, with 
lower loads subsequently depending on whether or not (or to what extent) side 
fillets are present. 
Fourth, the fracture surface of the peeled solder joints give typically more 
information than do the peel-load histories, because the ONLY really important 
finding is whether or not adequate wetting has taken place, i.e. the 
separation is mostly in the solder vs. being interfacial; or whether or not the 
metallization is the 'weakest' link, i.e. the separation is between metallization 
layers. Good quality solder joints frequently cause failure between the 
soldering pad and the component/PCB resin matrix.
Fifth, for leaded solder joints, the reliability in actual use does to a 
large extent depend on the heel fillet and the 'bottom flat' wetting; if the foot 
length is <3W, than also on the presence of a toe fillet, because short feet 
'rock' during thermal cycling. Side fillets are less important, unless you have 
wetting problems.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2