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June 2005

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Fri, 10 Jun 2005 20:08:02 -0400
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Ken

I think you need another supplier. 

We capped vias for years on immersion silver boards in Richmond (the old AT&T facility) without these perceived problems. Capping in most cases will provided the same enhancements as plugging. It can also be carried out after the immersion silver process. 

The boards we built were always in a panel format when they went through immersion silver. We were using the very first of all immersion silver processes; the processes and chemistries are now a great deal more robust and will withstand a great deal more abuse. 

You may need to remind your supplier that we now live in the 21st century and they should begin the pilgrimage. 

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389   
  ----- Original Message ----- 
  From: Kanaiyalal Patel<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Friday, June 10, 2005 5:23 PM
  Subject: [TN] Immersion Silver - Via Plugging


  Our supplier is recommending against plugging via holes the immersion silver boards and here is their explanation. Need some input into how you guys are managing.

  "We can not plug before silver because chemicals used during the silver process may become trapped. Over time these chemicals can eat away at the hole wall copper creating voids.
  2. Because the boards have passed through rout and are in piece form when silver is applied the board can not be plugged in panel form as are the gold boards.
  3. Immersion silver is soft and easily damaged. It is our last manufacturing process and we avoid handling it as much as possible after being coated, this particularly applies for the plug process."

  Appreciate your feedback.
  re,
  Hemant


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