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June 2005

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Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Fri, 10 Jun 2005 09:38:46 -0700
Content-Type:
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You can get all the info you want on the NEMI website.  There is currently a
lot of IC  industry interest in pushing the matte tin thickness spec up to
10 micrometers from the current typical 7-8 micrometers due to the belief
that the thicker material will provide a better whisker performance, but
little substantiating data is available.


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway
Sent: Friday, June 10, 2005 10:08 AM
To: [log in to unmask]
Subject: [TN] Matte Tin specification question


Good Morning TechNet,

Could someone point me in the direction of a specification for required
plating thickness of matte tin?  Or if someone knows the industry
recommended thickness, please pass that along.
The application would be for component leads, not final finish on the pc
board.

Thank you for the help,
Jana Carraway

Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR  97035
503.697.5291, ext 1180
email: [log in to unmask]

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