There were major lawsuits involving Sumitomo, Fujitsu, Cirrus Logic, and
Amkor, and possibly others, dealing with the phosphorus in IC package mold
compounds. The use of this material in mold compounds is now considered
'the plague' to the IC industry, and I do not believe it will ever cycle
back. People are even trying to get manufacturers of MCs to remove the tiny
amount of a catalyst commonly used in MCs that contains a small amount of
phosphorous in a chemical complex.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Genny Gibbard
Sent: Friday, June 10, 2005 10:01 AM
To: [log in to unmask]
Subject: Re: [TN] Red Phosphorus Fire Retardant
I find this discussion regarding Phosphorus, especially red, quite
interesting.
Just over two years ago, we had a couple of customers contact us, asking us
to confirm that we have not used any components using red phosphorus in
their molding compound, due to it causing component failures.
Now it seems from some of this discussion that we may be returning to this
substance?
-----Original Message-----
From: Fox, Ian [mailto:[log in to unmask]]
Sent: 10-Jun-05 1:11 AM
To: [log in to unmask]
Subject: [TN] Red Phosphorus Fire Retardant
My simplistic understanding of red phosphorus and fire retardancy is that
under application of a flame the red phosphorus combines with oxygen and
water from the polymer to form phosphoric acid leaving a flame-resistant
char behind. The char effectively acts as a barrier and prevents access by
the flame to further fuel.
Regards
Ian
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