oooppss... I just answered with a very different answer.  This isn't a
very clear area for requirements.




Susan Mansilla <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/10/2005 09:23 AM
Please respond to TechNet E-Mail Forum; Please respond to Robisan1


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] PCB thickness measurement method
Hi Kathy
The words you are looking for are in MIL-PRF-55110

A.6.4.1 Board thickness. The overall printed wiring board thickness
ncludes metallic depositions, fusing, and solder mask. The overall
thickness is measured across the printed wiring board extremities
(thickest part), unless a critical area, such an edge card
connector or card guide mounting location, is identified on the
master drawing.

This definition found in T-50 states that the thickness includes
the laminate and metallization on the outer layers.

Susan Mansilla
Robisan Lab

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