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June 2005

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Subject:
Re: PCB thickness measurement method
From:
Susan Mansilla <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 10 Jun 2005 09:23:23 EDT
Content-Type:
text/plain
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text/plain (28 lines) 
Hi Kathy
The words you are looking for are in MIL-PRF-55110

A.6.4.1 Board thickness. The overall printed wiring board thickness includes
metallic
depositions, fusing, and solder mask. The overall thickness is measured
across the printed
wiring board extremities (thickest part), unless a critical area, such an
edge card
connector or card guide mounting location, is identified on the master
drawing.

This definition found in T-50 states that the thickness includes the laminate
and metallization on the outer layers.

Susan Mansilla
Robisan Lab

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