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June 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Thu, 2 Jun 2005 16:01:08 +0200
Content-Type:
text/plain
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text/plain (50 lines)
Not me...>>> Dave Harman
/Ingemar

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of bob wettermann
Sent: den 2 juni 2005 14:39
To: [log in to unmask]
Subject: [TN] Rework considerations.


Dear Ingemar:

We would recommend that :

1.  If your exposure from a commercial standpoint is high that you perform temp cycling tests as you have indicated

2. Make sure that mask off nearby components so as to not "spread" the problem around the board

3. Perform accelerated thermal shock testing using very rigorous testing variables until failure of the device or board. Epoxies will break down eventually

4. If repairing a lifted pad or land use epoxy as the replacement means and not the adhesive dry film method as the pull strength will be a limiting factor.

Regards

Bob Wettermann


Bob Wettermann

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