Does anybody know what can be done to a properly plated ENIG
board to degrade the solderability.

i.e. Storage conditions? can I affect solderability by storing the
boards in a particular environment? If so, what are those conditions?

Improper cleaning before assembly? Can this degrade solderability?
what conditions?

Improper baking?

Improper handling?

I had some solderability issues with some ENIG boards and then
had them analyzed outside (EDX and SEM). The lab found nothing
wrong with the plating. Good phosphorous levels and no nickel
corrosion. Because there was still gold present on some pads after
reflow, that led them to believe that some barrier must be present on
the gold surface, preventing the solder from contacting the gold
surface.

Does anybody have any ideas on what could be wrong?

-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

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