Hi, Vladimir,
I will have the info regarding the measuring equipment in an hour or so.
-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Wednesday, June 08, 2005 10:36 PM
To: [log in to unmask]
Subject: Re: [TN] Solderability issues with ENIG finish
Hi Wernier,
I've said it earlier on today and want to repeat it again: if the data
represent EDS analysis, then I'd be very causious. It's almost not possible
to get reliable numbers with EDS from a regular (not specially prepared
sample). What makes me even more alleryed is the numbers for such elements
as C, O and N. The technique just isn't good enough for it.
Regards,
Vladimir Igoshev
RIM
Sent from my Blackberry Wireless
Vladimir Igoshev, 519-888-7465 ext.5283
-----Original Message-----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Jun 08 22:22:34 2005
Subject: Re: [TN] Solderability issues with ENIG finish
Hi Michael,
The test labs analysis is essentially correct.
The give-away in Area "a" is the high phosphorous content, and the low Sn
content. This is a clear sign of "Black Pad." The high Au content is owever,
surprising--that should have moved into the solder volume. Area "B" is
normal, but
here the absence of Au is surprising.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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