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June 2005

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Subject:
Re: Removal of tin oxide(s) and hydroxides from tin plate
From:
"<Richard Edgar>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 9 Jun 2005 08:23:30 EDT
Content-Type:
text/plain
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text/plain (22 lines) 
The best method would be to place the boards into an immersion tin  bath.
The immersion tin bath is acidic and will remove any oxide/hydroxide  finish
from the surface.  For over 40 years immersion tin has been used in  the
electronic industry.  One of its uses was to "refresh" a  solder surface. Oxide coated
tin/lead finishes were cleaned and recoated with a  thin coating of tin.  In
this application it will easily refresh  yours.  You might want to consider
using one of the new "immersion  white tin" chemistries since they will coat any
exposed copper that might  have appeared. .

Rich Edgar
Tec-Line Inc.

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