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June 2005

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Wed, 8 Jun 2005 22:36:18 -0400
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Hi Wernier,

I've said it earlier on today and want to repeat it again: if the data represent EDS analysis, then I'd be very causious. It's almost  not possible to get reliable  numbers with EDS from a regular (not specially prepared sample). What makes me even more alleryed is the numbers for such elements as C, O and N.  The technique just  isn't good enough for it.


Regards,


Vladimir Igoshev
RIM
Sent from my Blackberry Wireless 
Vladimir Igoshev, 519-888-7465 ext.5283


-----Original Message-----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Jun 08 22:22:34 2005
Subject: Re: [TN] Solderability issues with ENIG finish

Hi Michael,
The test labs analysis is essentially correct.
The give-away in Area "a" is the high phosphorous content, and the low Sn
content. This is a clear sign of "Black Pad." The high Au content is owever,
surprising--that should have moved into the solder volume. Area "B" is normal, but
here the absence of Au is surprising.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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