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June 2005

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 8 Jun 2005 22:22:34 EDT
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Hi Michael,
The test labs analysis is essentially correct.
The give-away in Area "a" is the high phosphorous content, and the low Sn
content. This is a clear sign of "Black Pad." The high Au content is owever,
surprising--that should have moved into the solder volume. Area "B" is normal, but
here the absence of Au is surprising.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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