My question is not regarding the diameter of the solder spheres after the
BGA has been placed on a board.
We reball components in order to use them in a repair environment. A solder
sphere has a different diameter once it has been reflowed onto the BGA.
I was looking for a general guideline such as if the pad is %65 of the
sphere diameter, the solder sphere will change its diameter such and such a
percentage.
David
>From: Bev Christian <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Bev
>Christian <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Solder Sphere Diameter
>Date: Wed, 8 Jun 2005 17:12:38 -0400
>
>Also the weight of the part.
>Bev
>RIM
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>Sent: June 8, 2005 5:07 PM
>To: [log in to unmask]
>Subject: Re: [TN] Solder Sphere Diameter
>
>That depends on a number of factors including the device weight vs the
>number of connections, coplanarity of the package when the solder
>solidifies
>etc.
>
>John
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
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>------------------------------------
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
>Sent: Wednesday, June 08, 2005 2:00 PM
>To: [log in to unmask]
>Subject: [TN] Solder Sphere Diameter
>
>
>Technetters:
>
>If a BGA has a pad of 20 mil and a solder sphere of 30 mil, what is the
>diameter of the solder sphere after it has been soldered to the BGA?
>
>
>David
>
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