Normally profile at 218 centigrade on the die surface of a BGA, this gives
the best flatness profile for typical eBGA constructions.

John

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
Sent: Wednesday, June 08, 2005 2:15 PM
To: [log in to unmask]
Subject: Re: [TN] Max reflow temperature/max cycles


Genny,

If it is standard 63/37 solder, the max should be around 205° Celcius to
ensure a good intermetallic bond.  But I am sure the gurus can explain it
better.

Regarding the max cycles, it depends on the class of board, the components
being used.

Are you in a repair or rework environment?


David



>From: Genny Gibbard <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              Genny
>Gibbard <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Max reflow temperature/max cycles
>Date: Wed, 8 Jun 2005 15:06:14 -0600
>
>Just wondering if there is a rule of thumb most people spec for the max
>reflow temperature allowed for a SnPb reflow process.  Or an IPC spec about
>this?  Also, what about how many cycles you would allow at the max reflow
>temperature?
>
>Genny
>
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