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June 2005

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 8 Jun 2005 17:12:38 -0400
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text/plain (88 lines)
Also the weight of the part.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: June 8, 2005 5:07 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Sphere Diameter

That depends on a number of factors including the device weight vs the
number of connections, coplanarity of the package when the solder solidifies
etc.

John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
Sent: Wednesday, June 08, 2005 2:00 PM
To: [log in to unmask]
Subject: [TN] Solder Sphere Diameter


Technetters:

If a BGA has a pad of 20 mil and a solder sphere of 30 mil, what is the
diameter of the solder sphere after it has been soldered to the BGA?


David

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