That depends on a number of factors including the device weight vs the
number of connections, coplanarity of the package when the solder solidifies
etc.

John
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
Sent: Wednesday, June 08, 2005 2:00 PM
To: [log in to unmask]
Subject: [TN] Solder Sphere Diameter


Technetters:

If a BGA has a pad of 20 mil and a solder sphere of 30 mil, what is the
diameter of the solder sphere after it has been soldered to the BGA?


David

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